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1

Simplified topology for integrated circuit buffer behavioural models

Diouf, Chérif El Valid, Telescu, Mihai, Stievano, Igor S., Tanguy, Noël, Canavero, Flavio G.

Journal:

IET Circuits Devices & Systems

Year:

2017

Language:

english

File:

PDF, 437 KB

english, 2017

2

Foreword: Special Section on Packaging and Interconnects: Cutting-Edge Solutions in Modeling, Design, and Characterization—Part I

Telescu, Mihai, Gu, Xiaoxiong, Sharma, Rohit

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

Language:

english

File:

PDF, 293 KB

english, 2019

3

Foreword: Special Section on Packaging and Interconnects: Cutting-Edge Solutions in Modeling, Design, and Characterization—Part I

Telescu, Mihai, Gu, Xiaoxiong, Sharma, Rohit

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

File:

PDF, 293 KB

2019

4

Foreword: Special Section on Packaging and Interconnects: Cutting-Edge Solutions in Modeling, Design, and Characterization—Part II

Telescu, Mihai, Gu, Xiaoxiong, Sharma, Rohit

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

File:

PDF, 703 KB

2019

5

Orthogonal decomposition of derivatives and antiderivatives for easy evaluation of extended Gram matrix

M. Telescu, P. Bréhonnet, N. Tanguy, P. Vilbé, L.C. Calvez

Journal:

Signal Processing

Year:

2006

Language:

english

File:

PDF, 135 KB

english, 2006

6

Efficient Gram-matrix computation for irrational resonant systems using Kautz models

M. Telescu, N. Tanguy, P. Bréhonnet, P. Vilbé

Journal:

Signal Processing

Year:

2007

Language:

english

File:

PDF, 322 KB

english, 2007

7

A simple algorithm for stable order reduction of z-domain Laguerre models

M. Telescu, N. Iassamen, P. Cloastre, N. Tanguy

Journal:

Signal Processing

Year:

2013

Language:

english

File:

PDF, 225 KB

english, 2013

8

[IEEE 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) - Naples, Italy (2011.05.8-2011.05.11)] 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) - Statically constrained nonlinear models with application to IC buffers

Diouf, C., Telescu, M., Tanguy, N., Cloastre, P., Stievano, I.S., Canavero, F.G.

Year:

2011

Language:

english

File:

PDF, 339 KB

english, 2011

9

[IEEE 2010 IEEE 14th Workshop on Signal Propagation on Interconnects - Hildesheim, Germany (2010.05.9-2010.05.12)] 2010 IEEE 14th Workshop on Signal Propagation on Interconnects - An application of Volterra series to IC buffer models

Telescu, M. G., Stievano, I. S., Canavero, F. G., Tanguy, N.

Year:

2010

Language:

english

File:

PDF, 191 KB

english, 2010

10

[IEEE 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. - Garmisch-Partenkirchen, Germany (May 10-13, 2005)] Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. - Model-order reduction of VLSI circuit interconnects via a laguerre representation

Telescu, M., Tanguy, N., Brehonnet, P., Vilbe, P., Calvez, L.C., Huret, F.

Year:

2005

Language:

english

File:

PDF, 464 KB

english, 2005

11

[IEEE 2007 IEEE Workshop on Signal Propagation on Interconnects - Ruta di Camogli, Italy (2007.05.13-2007.05.16)] 2007 IEEE Workshop on Signal Propagation on Interconnects - Stable model order reduction method using Kautz functions: Application to VLSI circuits

Telescu, Mihai, Brehonnet, Pascale, Tanguy, Noel, Vilbe, Pierre

Year:

2007

Language:

english

File:

PDF, 1.25 MB

english, 2007

12

On the Use of Equality Constraints in the Identification of Volterra–Laguerre Models

Diouf, C., Telescu, M., Cloastre, P., Tanguy, N.

Journal:

IEEE Signal Processing Letters

Year:

2012

Language:

english

File:

PDF, 1008 KB

english, 2012

13

[IEEE 2012 IEEE 16th Workshop on Signal and Power Integrity (SPI) - Sorrento, Italy (2012.05.13-2012.05.16)] 2012 IEEE 16th Workshop on Signal and Power Integrity (SPI) - Versatile surrogate models for IC buffers

Diouf, C., Telescu, M., Stievano, I. S., Canavero, F. C., Cloastre, P., Tanguy, N.

Year:

2012

Language:

english

File:

PDF, 1.01 MB

english, 2012

14

[IEEE Research in Microelectronics and Electronics, 2005 PhD - Lausanne, Switzerland (July, 25, 2005)] Research in Microelectronics and Electronics, 2005 PhD - Laguerre-gram reduced order modeling applied to VLSI circuit interconnects

Telescu, M., Brehonnet, P., Tanguy, N., Vilbe, P., Calvez, L.C.

Year:

2005

Language:

english

File:

PDF, 192 KB

english, 2005

15

[IEEE 2006 IEEE Workship on Signal Propagation on Interconnects - Berlin, Germany (2006.05.9-2006.05.12)] 2006 IEEE Workship on Signal Propagation on Interconnects - Low Complexity Equivalent Circuit Models for VLSI Interconnects

Telescu, M., Tanguy, N., Brehonnet, P., Vilbe, P., Calvez, L.C.

Year:

2006

Language:

english

File:

PDF, 1.77 MB

english, 2006

16

Parameter optimization of orthonormal basis functions for efficient rational approximations

Tanguy, N., Iassamen, N., Telescu, M., Cloastre, P.

Journal:

Applied Mathematical Modelling

Year:

2015

Language:

english

File:

PDF, 488 KB

english, 2015

17

[IEEE 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) - Turin, Italy (2016.5.8-2016.5.11)] 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) - On the use of digital predistortion to compensate the nonlinear effects of semiconductor optical amplifiers

Azou, S., Bejan, S., Morel, P., Diouf, C., Sharaiha, A., Telescu, M., Tanguy, N.

Year:

2016

Language:

english

File:

PDF, 631 KB

english, 2016

18

[IEEE 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) - Turin, Italy (2016.5.8-2016.5.11)] 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) - Robust nonlinear models for CMOS buffers

Diouf, C., Telescu, M., Tanguy, N., Stievano, I. S., Canavero, F. G.

Year:

2016

Language:

english

File:

PDF, 335 KB

english, 2016

19

Present and future of I/O-buffer behavioral macromodels

Signorini,, Siviero,, Telescu,, Stievano,

Journal:

Electromagnetic Compatibility Magazine, IEEE

Year:

2016

Language:

english

File:

PDF, 3.27 MB

english, 2016

20

[IEEE 2017 IEEE 21st Workshop on Signal and Power Integrity (SPI) - Lake Maggiore, Italy (2017.5.7-2017.5.10)] 2017 IEEE 21st Workshop on Signal and Power Integrity (SPI) - Order reduction of Volterra and Volterra-Laguerre Models

Telescu, Mihai, Tanguy, Noel

Year:

2017

Language:

english

File:

PDF, 258 KB

english, 2017

21

Robustness analysis of a parallel two-box digital polynomial predistorter for an SOA-based CO-OFDM system

Diouf, C., Younes, M., Noaja, A., Azou, S., Telescu, M., Morel, P., Tanguy, N.

Journal:

Optics Communications

Year:

2017

Language:

english

File:

PDF, 1.52 MB

english, 2017

22

[IEEE 2017 29th International Conference on Microelectronics (ICM) - Beirut, Lebanon (2017.12.10-2017.12.13)] 2017 29th International Conference on Microelectronics (ICM) - Robustness improvement of compact predistorters in a CO-OFDM system using semiconductor optical amplifiers

Younes, M., Telescu, M., Tanguy, N., Diouf, C., Morel, P., Azou, S.

Year:

2017

File:

PDF, 737 KB

2017

23

[IEEE 2017 IEEE 12th International Conference on ASIC (ASICON) - Guiyang (2017.10.25-2017.10.28)] 2017 IEEE 12th International Conference on ASIC (ASICON) - Tensor-network-based predistorter design for multiple-input multiple-output nonlinear systems

Chen, Cong, Batselier, Kim, Telescu, Mihai, Azou, Stephane, Tanguy, Noel, Wong, Ngai

Year:

2017

Language:

english

File:

PDF, 279 KB

english, 2017

24

[IEEE 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA (2018.10.14-2018.10.17)] 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - A Fast Channel Simulation Framework Based on Hierarchical Waveform Representations

Siviero, C., Stievano, I. S., Grivet-Talocia, S., Signorini, G., Telescu, M.

Year:

2018

File:

PDF, 7 KB

2018

25

[IEEE 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA (2018.10.14-2018.10.17)] 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - A Fast Channel Simulation Framework Based on Hierarchical Waveform Representations

Siviero, C., Stievano, I. S., Grivet-Talocia, S., Signorini, G., Telescu, M.

Year:

2018

File:

PDF, 7 KB

2018

26

Constructive Signal Approximations for Fast Transient Simulation of Coupled Channels

Siviero, C., Trinchero, R., Grivet-Talocia, S., Stievano, I. S., Signorini, G., Telescu, M.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

Language:

english

File:

PDF, 3.76 MB

english, 2019

27

Foreword: Special Section on Packaging and Interconnects: Cutting-Edge Solutions in Modeling, Design, and Characterization—Part II

Telescu, Mihai, Gu, Xiaoxiong, Sharma, Rohit

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

Language:

english

File:

PDF, 703 KB

english, 2019

28

The effects of digital predistortion in a CO-OFDM system â a stochastic approach

Sime, Jacqueline E., Morel, Pascal, Younes, Mohamad, Stievano, Igor S., Telescu, Mihai, Tanguy, Noel, Azou, Stephane

Journal:

IEEE Photonics Technology Letters

Year:

2020

File:

PDF, 1.23 MB

2020